AI Hardware & Photonics: Unlocking the Next Wave of Compute and Connectivity

At NMK AI, we believe the future of compute will be defined not just by more transistors—but by smarter architectures, tighter integration, and breakthroughs in photonics. That’s why three of our most promising bundles focus squarely on the intersection of AI hardware and photonics packaging:

• In-Package Photonics & Advanced Chiplet Interconnect

• CPO Yield Optimization & Serviceability

• On-Chip Light Sources & Isolation

Together, these bundles address the performance, manufacturability, and scalability bottlenecks that today’s chipmakers and hyperscalers face as they build the AI data centers of tomorrow.

🌐 The Challenge: Bandwidth and Heat Are AI’s Bottlenecks

AI training and inference workloads are exploding, but the bottlenecks aren’t compute cores—they’re bandwidth and thermals. GPUs and accelerators are starving for memory bandwidth, and heat throttling is becoming a first-order limiter.

Meanwhile, co-packaged optics (CPO) and on-chip photonics are rising as the only scalable path forward. But adoption is slowed by yield challenges, integration costs, and the lack of manufacturable light sources that fit inside CMOS processes.

💡 Our Bundles: Built for the Hardest Problems

1. In-Package Photonics & Advanced Chiplet Interconnect

This bundle delivers UCIe 2.0-compatible chiplet links with integrated photonics and advanced thermal management. It includes:

• High-density vertical interposers

• Photonic/electrical hybrid interconnects

• On-package microfluidics for cooling

Why it matters: It collapses latency and heat, enabling future-proof AI accelerators.

2. CPO Yield Optimization & Serviceability Platform

CPO is inevitable—but yields are brutal. This bundle tackles manufacturability head-on with:

• Wider alignment tolerances

• Post-assembly calibration methods

• Modular serviceability

Why it matters: It makes co-packaged optics viable at scale, reducing cost per bit and derisking hyperscale adoption.

3. On-Chip Light Sources & Isolation Stack

No more relying on external lasers. This bundle integrates:

• Silicon-compatible quantum dot lasers

• On-chip isolators to reduce reflection

• Foundry-friendly processes

Why it matters: It enables true photonic integration, simplifying supply chains and collapsing the BOM for next-gen optical interconnects.

🚀 Why Acquirers and Researchers Care

For researchers and TTOs, these bundles represent an opportunity to see advanced photonics IP packaged, co-invented, and monetized—not left dormant. For acquirers and corporates, they’re acquisition-grade, diligence-ready packages that map directly onto roadmap pain points:

• Chipmakers gain better bandwidth per watt

• Hyperscalers get scalable optics in their racks

• Foundries unlock new revenue in photonic-enabled processes

📦 Case Study Snapshot

Our In-Package Photonics bundle (developed in partnership with a U.S. national lab and Japanese photonics group, with NMK’s own diagnostic IP) is already under review by five potential partners—three acquirers and two licensing targets.

This proves what we’ve built at NMK AI: bundles that move fast, speak to real bottlenecks, and are structured for deals.

🔮 The Big Picture

AI hardware will only scale if we reinvent how we move bits and heat. Photonics isn’t just a research curiosity—it’s becoming the foundation of AI infrastructure.

At NMK AI, we’re using our AI deep-research agents + co-invention process to scout, bundle, and commercialize the IP that makes this future possible.

24 bundles are already live. These three—AI hardware & photonics—are at the center of the storm.

👉 Want to see how your research or portfolio fits into our next bundle? Or are you a buyer looking for a packaged, diligence-ready photonics play?